3D Models
The KiCad 3D model libraries are the individual .3dshapes directories.
These 3d models are best used in combination with the official footprint libs.
Each directory directory contains multiple 3D model files, with the following supported file formats.
WRL
WRL files provide support for material properties, allowing superior 3D rendering within KiCad
STEP
STEP files are required for integration with MCAD software.
Updating via Git
Users who wish to keep 3D model libraries up to date can track the https://github.com/kicad/kicad-packages3d GitHub repository.
Contributing
Users who wish to contribute to the 3D model libraries can submit a pull request at https://github.com/kicad/kicad-packages3d.
Source files for 3D models can be found at https://github.com/kicad/kicad-packages3d-source.
Library Releases
The latest complete set of KiCad 3D model libraries can be downloaded from the following link:
https://github.com/kicad/kicad-packages3d/archive/master.zip
Stable releases of the 3D model libraries can be found at:
https://github.com/kicad/kicad-packages3d/releases
| Library | Description | Models | Download |
|---|---|---|---|
| Button_Switch_SMD | Buttons and switches, surface mount | 76 | 693K |
| Button_Switch_THT | Buttons and switches, through hole | 78 | 962K |
| Capacitor_SMD | Capacitor, surface mount | 64 | 1.3M |
| Capacitor_THT | Capacitor, through hole | 714 | 3.8M |
| Capacitor_Tantalum_SMD | Tantalum Capacitor, surface mount | 22 | 158K |
| Connector | Generic/unsorted connector footprints | 22 | 36K |
| Connector_Coaxial | Coaxial and RF connector footprints | 2 | 18K |
| Connector_IDC | IDC connector footprints | 56 | 2.1M |
| Connector_JST | JST connector footprints www.jst.com | 178 | 5.0M |
| Connector_Molex | Molex connector foottprints www.molex.com | 202 | 9.6M |
| Connector_Phoenix_MC | Phoenix MC connector footprints | 492 | 4.6M |
| Connector_Phoenix_MSTB | Phoenix MSTB connector footprints | 536 | 3.8M |
| Connector_PinHeader_1.00mm | Pin headers, 1.0mm pitch | 556 | 20M |
| Connector_PinHeader_1.27mm | Pin headers, 1.27mm pitch | 556 | 20M |
| Connector_PinHeader_2.00mm | Pin headers, 2.0mm pitch | 556 | 20M |
| Connector_PinHeader_2.54mm | Pin headers, 2.54mm pitch | 556 | 20M |
| Connector_PinSocket_1.00mm | Pin sockets, 1.00mm pitch | 312 | 15M |
| Connector_PinSocket_1.27mm | Pin sockets, 1.27mm pitch | 492 | 29M |
| Connector_PinSocket_2.00mm | Pin sockets, 2.0mm pitch | 556 | 28M |
| Connector_PinSocket_2.54mm | Pin sockets, 2.54mm pitch | 556 | 28M |
| Connector_USB | USB connector footprints | 2 | 135K |
| Converters_DCDC_ACDC | 92 | 372K | |
| Crystal | Crystal footprints | 114 | 381K |
| Diode_SMD | Diode footprints, surface mount | 44 | 134K |
| Diode_THT | Diode footprints, through hole | 132 | 385K |
| Display | Display modules | 60 | 1.3M |
| Display_7Segment | Seven segment Display | 72 | 1.5M |
| Fuse_Holders_and_Fuses | 2 | 54K | |
| Inductor_SMD | Inductor footprints, surface mount | 40 | 51K |
| LED_THT | Light emitting diodes (LED), through hole | 118 | 237K |
| OptoDevice | Optical devices (light sensors, opto isolators/interrupters, laser diodes, fiber optical components ...) | 10 | 71K |
| Package_BGA | Ball Grid Array (BGA) | 48 | 807K |
| Package_DFN_QFN | Surface mount IC packages, DFN / LGA / QFN | 174 | 1.6M |
| Package_DIP | Through hole IC packages, DIP | 246 | 4.1M |
| Package_QFP | Quad Flat Package (QFP) | 88 | 11M |
| Package_SOIC | 24 | 550K | |
| Package_SON | Small Outline No-Lead (SON) | 26 | 170K |
| Package_SSOP | 112 | 2.4M | |
| Package_TO_SOT_SMD | Surface mount transistor packages | 124 | 671K |
| Package_TO_SOT_THT | Through hole transistor packages | 72 | 318K |
| RF_Module | Radio-frequency / wireless modules | 6 | 224K |
| Relay_THT | Through hole relay packages | 4 | 22K |
| Resistor_THT | Resistor footprints, through hole (THT) | 62 | 559K |
| Sensor_Current | Specialized footprints for current sensors | 2 | 185K |
| TestPoint | Test points, measurement points, probe connection points | 44 | 328K |
| Valve | Valve | 2 | 32K |
Last updated on 13 August 2018